PCB Hot Air Solder Leveling Machine / PCB Making Machine

• Certification: ISO, CE
• Automation: Automation
• Work Pressure: 0.4--------0.7MPa
• Air Pressure: 0.8------1.0 MPa
• Dimensions: 1600mm*1300mm*2500mm
• Weight: 1100kg
• Model NO.: SUNY-ZPX800
• Material: Stainless Steel.316L or 321
• Tin Pump Material: Ibid
• Transport Package: Standard Export Package
• Trademark: Labkits
• Origin: Hunan China
• Production Capacity: 500/Month

Product Description

PCB Hot Air Solder Leveling Machine / PCB making machine 
Model: SUNY-ZPX800
Main technical:

1. Maximum PCB board size:; 510mm*600mm/0'3mm-3,8mm.
2. Tin pan capacity(3000 type):240 KG     
3. Solder composition: Pure Tin [lead], Copper content in less than CU2 +---- 0.3 ‰                
4. Recommended Model; AOF ----- 1 ---- 202
5. Solder composition:Tin-lead solder mixture, 66 & 3, 66 %33. PCB circuit board dedicated.
6. Work pressure:0.4--------0.7mpa       
7. Air pressure:0.8------1.0 mpa           
8. Dimensions:1600mm*1300mm*2500mm      
9. Weight:1100Kg
10. Tin pot size(3000 type): 750mm*700mm*50mm*8mm
11. Tin pot size(3200 type): 850mm*850mm*50mm*8mm
12. Material:Icr18Ni9T.or [316L]
13. Air knife:550mm*90mm.
14. The surface treatment coating Special Branch never stick tin alloy, maintenance-free.
15. Material:Stainless steel.316L or 321;
16. Tin pump material:ibid
17. Tin pump operating mode: Frequency Control [no-class,] to complete the tin material billowing uniform performance.

Performance advantages

1. Heating method: Conventional heating plate, tin-pot heating, 2.5KW/380V = 6pcs
2. 2KW/380V = 4pcs, 1.5KW/380V3 block. Tin pan power: 27.5KW
3. Tin tin pot melting capacity of 240Kg-260Kg, needs 26 degrees to 30 degrees electric
4. Air heating box:2 sets. 3pcs for each sets.
5. 4.5KW/380V*6pcs = 27KW.
6. Tin pump motor 1.1KW/380V
7. Total equipment power consumption: 58KW